The Xilinx Platform Flash PROM Family is an obsolete part family that offers comprehensive solutions in a single, high-performance, cost-effective family. These PROMs provide advanced configuration memory with features that enhance flexibility and performance for Virtex™ and Spartan™ FPGAs. Additionally, they are built on proven technology that integrates Xilinx’s expertise in configuration control logic with a reliable partner in Flash memory technology.

Despite their obsolescence, these components remain valued for their small package size and high densities. At Microchip USA, we can assist you in sourcing this hard-to-find part and provide you with cost-saving solutions!

Xilinx Platform Flash PROM Family

The Xilinx Platform Flash PROM Family is available in densities ranging from 1 to 32 Mb and offers an easy-to-use, cost-effective, and reprogrammable solution for storing large Xilinx FPGA configuration bitstreams. The Platform Flash PROM series includes the 3.3V XCFxxS and the 1.8V XCFxxP versions. The XCFxxS variant comes in 4 Mb, 2 Mb, and 1 Mb options, supporting Master Serial and Slave Serial FPGA configuration modes. The XCFxxP variant is available in 32 Mb, 16 Mb, and 8 Mb options, supporting Master Serial, Slave Serial, Master SelectMAP, and Slave SelectMAP FPGA configuration modes. When driven by a stable external clock, these PROMs can output data at rates up to 33 MHz.

Features

• In-System Programmable PROMs for Configuration of Xilinx® FPGAs
• Low-Power Advanced CMOS NOR Flash Process
• Endurance of 20,000 Program/Erase Cycles
• Operation over Full Industrial Temperature Range (–40°C to +85°C)
• IEEE Standard 1149.1/1532 Boundary-Scan (JTAG) Support for Programming, Prototyping, and Testing
• JTAG Command Initiation of Standard FPGA Configuration
• Cascadable for Storing Longer or Multiple Bitstreams
• Dedicated Boundary-Scan (JTAG) I/O Power Supply (VCCJ)
• I/O Pins Compatible with Voltage Levels Ranging From 1.8V to 3.3V
• Design Support Using the Xilinx ISE® Alliance and Foundation™ Software Packages

XCF01S/XCF02S/XCF04S

• 3V Supply Voltage
• Serial FPGA Configuration Interface
• Available in Small-Footprint VO20 and VOG20 Packages

 XCF08P/XCF16P/XCF32P

• 8V Supply Voltage
• Serial or Parallel FPGA Configuration Interface
• Available in Small-Footprint VOG48, FS48, and FSG48 Packages
• Design Revision Technology Enables Storing and Accessing Multiple Design Revisions for Configuration
• Built-In Data Decompressor Compatible with Xilinx Advanced Compression Technology

Programming

The Xilinx Platform Flash PROM Family is a reprogrammable NOR flash device with several programming solutions.

In-System Programming

In-system programmable PROMs can be individually programmed or daisy-chained using the standard 4-pin JTAG protocol. Additionally, the iMPACT software supports this process and can generate SVF files for compatibility with various tools.

External Programming

In traditional manufacturing, third-party device programmers can pre-program Platform Flash PROMs with an initial memory image before board assembly. These pre-programmed PROMs can be soldered onto boards following standard guidelines and can be updated later using an in-system programming solution.

Reliability and Endurance

Xilinx in-system programmable products offer a guaranteed endurance of 20,000 program-erase cycles and a minimum data retention of 20 years. All Xilinx Planform Flash PROM devices meet all functional, performance, and data retention specifications within this endurance limit.

Key Characteristics

The Xilinx Platform Flash PROM Family stands out for two key reasons: its cost-effective in-system programmability and its extensive range of densities, offering exceptional flexibility for various applications.

Low-Cost In-System Programmability

Xilinx Platform Flash PROMs offer flexibility for managing the configuration of systems with multiple FPGAs.

Competitively Priced Configuration PROMs

Small Area per Megabit

• Reduces amount of board space required for configuration
• VO20 (Thin Shrink Small-Outline, 20 leads) and the FS48 (Thin Flat Ball Grid Array, 48 balls) packages

Complete 1-Mbit to 32-Mbit PROM Family

• Use just one Platform Flash PROM to configure Xilinx FPGAs
• Simplifies manufacturing flow
• Reduced inventory cost

In-System Programmability

• Easy design changes during all phases of the product lifecycle (including development and verification)
• Simplifies manufacturing flow and board test
• Enables easy field upgrades

Xilinx Advanced Compression Technology

• Increases effective memory capacity by up to 50%
• Available in all high-density devices (8 Mbits to 32 Mbits)

Xilinx ISE Tools and Programming Support

• Compatible with existing ISE software tools

Broad Density Range and Flexibility

The Xilinx Platform Flash PROM Family includes 3 low-density and 3 high-density devices to support the configuration of all Xilinx FPGAs.

Low-Density Devices

• Serial configuration PROMs in densities of 1, 2, and 4 Mbits in the VO20 package (Thin Shrink Small-Outline Package, 20 leads)

High Density Devices

• 8-, 16-, and 32-Mbit densities in FS48 package (Thin Flat Ball Grid Array, 48 balls)
• Serial and parallel configuration

Powerful Advantages

• Up to 32 Mbits of configuration space in a small (72-mm2 ) footprint allows the storage of several programs in a single, very-small footprint PROM.
• Design Revisioning allows a single high-density PROM to be programmed for multiple applications, enabling the use of one Platform Flash PROM and system board to deliver various functions.
• Xilinx Advanced Compression Technology provides 50% more bits of storage
• SelectMAP decreases FPGA configuration time
• No need for additional programming expense

Obsolescence

The Xilinx Platform Flash PROM Family has been discontinued, leaving companies without direct replacements. As a result, many are searching for alternative components or redesigning their products to accommodate different parts. This transition has required extensive planning and adjustments to ensure continuity, with companies commonly facing challenges such as:

• Supply Chain Disruptions
• Increased Costs
• Compatibility Issues
• Quality and Reliability Concerns
• Inventory Management
• Customer Dissatisfaction
• Complex Redesign Processes
• Technical Support