Samsung Shows 3D AI Chip Packaging Tech to Rival TSMC
Samsung Electronics Co., the world’s largest memory chipmaker, is preparing to launch an advanced 3D chip packaging technology called SAINT (Samsung Advanced Interconnection Technology.) The goal is to compete with Taiwan Semiconductor Manufacturing Company (SMC), the leader in foundry services. SAINT technology enables the merging memory and processors required for high-performance chips, including AI chips,…
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