The AMD XCF32PFSG48C is a high-reliability Configuration PROM designed for FPGA (Field-Programmable Gate Array) configuration. This component falls under the category of Configuration PROMs for FPGAs, ensuring seamless and efficient programming of FPGA devices. It is packaged in a tray format, with the physical configuration encapsulated within a 48-TFBGA (Thin Fine-Pitch Ball Grid Array), CSPBGA (Chip-Scale Package Ball Grid Array) package. This surface-mount device is designed to be mounted directly onto circuit boards, providing a compact footprint ideal for dense circuit layouts.

With an operating temperature range of -40°C to 85°C, the XCF32PFSG48C is engineered to withstand extreme conditions, making it suitable for a wide range of industrial applications. The component is offered in a 48-CSP (8×9) device package, which further emphasizes its compactness and ease of integration into various system designs.

Although now classified as obsolete, the XCF32PFSG48C has played a crucial role in the development and function of numerous systems within various industries. Its primary use has been in the configuration of FPGAs, serving as a critical component in the initial setup and programming of these versatile devices. These industries have ranged from telecommunications and automotive to consumer electronics and beyond, where the programmability and flexibility of FPGAs are highly valued.

This PROM’s obsolescence might necessitate looking for current alternatives or securing sufficient stock for maintenance purposes on legacy systems. Nonetheless, the AMD XCF32PFSG48C represents a foundational technology in FPGA configuration, contributing significantly to the advancement and functionality of electronic systems across multiple sectors.